High Pressure Test Chamber

High Pressure Test Chamber is an environmental testing equipment that can simulate high temperature, high humidity and high pressure environment. It is mainly used to accelerate the aging process of test materials, and then evaluate the durability and reliability of products under such environmental conditions through test results. It can make the tested samples experience several years or even decades of natural aging process in a short period of time by controlling the temperature, humidity and pressure parameters in the chamber, and then verify the problems that may occur in the long-term use of materials through test data.

The working principle of High Pressure Test Chamber is based on controlling the temperature, humidity and pressure conditions in the chamber to make the tested product undergo a natural aging process of several months, years or even decades in a short period of time. This accelerated aging method can effectively test and present in advance the problems that may occur in the long-term use of materials, such as cracking, fading, and performance degradation, so that enterprises can make improvements in advance.

GB/T10586-1989 Technical conditions for humidity and heat test chamber;

GB2423.3-93 (IEC68-2-3) Constant humidity and heat test;

MIL-STD810D method 502.2;

GJB150.9-8 Temperature and humidity test;

GB2423.34-86, MIL-STD883C method 1004.2 Temperature, humidity and high pressure combined cycle test;

GB2423-2-1-89\GB2423-3-2-89\GB2423-3-89 High temperature, high pressure and high humidity aging box execution and compliance standards.

High Pressure Test Chamber has a wide range of applications:

1. In the semiconductor industry, it is mainly used to test the moisture resistance of semiconductor packages.
Under harsh temperature, humidity and pressure environments, moisture may penetrate into the package along the colloid or the interface between the colloid and the lead frame, causing it to fail. Common causes of failure include open circuits caused by corrosion of the dynamic metallization area and short circuits caused by contamination between the package pins.

2. Electronic components: usually suitable for accelerated life reliability tests of IC packages, microelectronic chips, magnetic materials and other electronic parts.

3. In the automotive industry, this test chamber is mainly used to test the reliability and durability of automotive interior and exterior trims, seals, wires and cables and other components. By simulating extreme high temperature and high humidity conditions, it ensures the normal operation of vehicles in harsh environments.

4. Building materials are mainly used to test the durability and stability of products such as coatings, waterproof materials, and thermal insulation materials.

5. In the aerospace field, it can truly simulate the temperature and pressure changes in high-altitude environments to evaluate the weather resistance and aging resistance of materials such as aircraft parts and spacecraft shells.

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