Products Description
Temperature Controlled Test Chamber is a kind of equipment widely used in many industries. It can simulate the temperature and humidity changes under different environmental conditions and test the physical properties of electronic and electrical components, automation components, communication equipment, automotive parts, metals, chemical products, plastics and other materials. This equipment is particularly critical in the fields of national defense, aerospace, military industry, and in the testing of BGA, PCB substrate wrenches, electronic chip ICs, semiconductors, ceramics, magnetic materials and polymer materials. It can evaluate the tolerance of materials under extreme temperature conditions and the chemical or physical damage that may occur to products under temperature changes, thereby ensuring product quality.

Technical parameter
|
Model |
B-TH-80 (A~G) |
B-TH-150 (A~G) |
B-TH-225 (A~G) |
B-TH-408 (A~G) |
B-TH-608 (A~G) |
B-TH-800 (A~G) |
B-TH-1000 (A~G) |
|
Inside size WxHxD (cm) |
40x50x40 |
50x60x50 |
50x75x60 |
80x85x60 |
80x95x80 |
100x100x80 |
100x100x100 |
|
Outside size WxHxD (cm) |
95x145x105 |
105x175x97 |
115x190x97 |
135x185x120 |
145x185x137 |
145x210x130 |
147x210x140 |
|
Temperature range |
0℃~+150℃ |
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|
Humidity range |
20%~98%R.H.(10%-98%R.H/5%~98%R.H is the specific condition) |
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Detection Capabilities
The Temperature Controlled Test Chamber has the following testing capabilities for electronic components: performance testing, troubleshooting, durability evaluation, stress screening, and environmental adaptability. This test chamber is an indispensable tool for ensuring product testing in various fields, from precision integrated circuits to heavy machinery components. It helps manufacturers improve product quality and meet the performance requirements of the entire machine. BOTO GROUP has launched the "Dual 85 Temperature and Humidity Environmental Test Chamber" to help customers in the electronic components industry understand the heat and humidity resistance of the product, provide important support for the company's product development and quality control, and help improve product competitiveness and user satisfaction.
High temperature storage
Most of the failures of electronic components are caused by various physical and chemical changes in the body and surface, which are closely related to temperature. When the temperature rises, the chemical reaction rate is greatly accelerated, which accelerates the failure process. So that defective components can be exposed in time and eliminated.
High temperature screening is widely used in semiconductor devices, which can effectively eliminate failure mechanisms such as surface contamination, poor bonding and oxide layer defects. Generally, it is stored at the highest junction temperature for 24~168 hours. High temperature screening is simple and easy, inexpensive, and can be performed on many components. After high temperature storage in the Temperature Controlled Test Chamber, the parameter performance of the components can be stabilized and the parameter drift during use can be reduced.
Power testing
During the screening process, the potential defects of the electronic components themselves and their surfaces can be effectively revealed by the combined effect of thermal and electrical stress, which is a key step to ensure the reliability of components. Screening of electronic components is usually carried out under rated power conditions, and the duration ranges from a few hours to up to 168 hours.
For some products, especially integrated circuits, changing the test conditions requires caution to avoid affecting their performance. In these cases, the junction temperature can be increased by increasing the operating temperature to achieve a high stress test state. Power refining testing requires the use of professional high and low temperature test chambers, which are more expensive, and the screening time should not be too long to avoid unnecessary waste of resources.
In the field of civilian products, the screening time is usually several hours to ensure the basic reliability of the product. For military use or products requiring higher reliability, the screening time may be extended to 100 to 168 hours. For aviation-grade components, the screening cycle may be longer, reaching 240 hours or more to meet performance requirements under extreme conditions. Through this meticulous screening process, the stability and reliability of electronic components in various application environments can be ensured, thereby improving the overall quality and performance of the final product.
Temperature cycle
Electronic products will face various environmental temperature challenges in practical applications. Due to the physical phenomenon of thermal expansion and contraction, components with insufficient thermal matching performance are prone to failure under temperature changes. Temperature cycling testing is a screening method that uses the stresses generated by temperature changes between extreme high and low temperatures to identify and eliminate components that may have thermal performance issues. This testing typically involves 5 to 10 cycles in a temperature range of -55°C to 125°C.
Power refining testing requires the use of professional testing equipment, which is often costly, so the duration of the screening process needs to be reasonably controlled. For consumer electronics, screening times are typically shorter, only a few hours, to ensure cost-effectiveness. For military applications or products requiring higher reliability, the screening time may be extended to 100 to 168 hours. As for aerospace-grade components, due to their extremely high reliability requirements, the screening cycle may be longer, reaching 240 hours or more.
Through this rigorous screening process, the stability and durability of electronic products in the face of extreme temperature conditions can be significantly improved, ensuring their application reliability in various environments.
Necessity of screening components
The inherent reliability of electronic components depends on the reliability design of the product. In the manufacturing process of the product, due to human factors or fluctuations in raw materials, process conditions, and equipment conditions, the final finished product cannot all achieve the expected inherent reliability. In each batch of finished products, there are always some products with some potential defects and weaknesses, which are characterized by early failure under certain stress conditions. The average life of early failure components is much shorter than that of normal products.
Whether electronic equipment can work reliably depends on whether electronic components can work reliably. If early failure components are installed together with the whole equipment, the failure rate of early failure of the whole equipment will be greatly increased, and its reliability will not meet the requirements, and it will also cost a huge price to repair. Therefore, whether it is a military product or a civilian product, screening is an important means to ensure reliability. Temperature Controlled Test Chamber is the best choice for environmental reliability testing of electronic components.
BOTO GROUP is manufacturer of environmental test chambers with over 20 years of experience.
Focusing on the production of various environmental testing equipment, the product series include: temperature and humidity test chamber, UV aging test chamber, Xenon aging test chamber, salt spray test chamber,mechanical testing machine, etc.
Welcome to contact us and send inquire if have any interest!
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