Temperature change testing verifies whether product performance meets established standards, providing crucial information for product design improvements, quality control, and factory acceptance. Also known as temperature cycling or temperature shock testing (thermal shock testing), this test primarily assesses the adaptability of components, equipment, and other products to rapid changes in ambient temperature during storage, transportation, and use. BOTO GROUP, a professional manufacturer of environmental testing equipment, provides customers with accurate and reliable temperature cycling testing equipment, helping them fully understand product performance in extreme temperature environments, thereby ensuring product reliability and safety.
Principles of Temperature Shock Testing
This test is based on the principle of thermal expansion and contraction. When a product is exposed to a rapidly changing temperature environment, its internal materials will generate internal stress due to rapid thermal expansion and contraction. If this stress exceeds the material's tolerance limit, it will cause the product to deform or fail.
Test Object
Temperature change testing is primarily conducted on material structures and composite materials, typically targeting electronic components and assembly-level products (such as PCBAs and ICs). BOTO provides comprehensive performance testing and reliability testing equipment for the optoelectronics, semiconductor, PCB/PCBA, and electronic components industries. We support customized equipment based on different product testing needs, offering one-stop testing solutions. For reliability equipment procurement needs, you're always welcome → contact us.
Applicable Standards
GBT2423.22 Environmental testing - Part 2: Test methods - Test N: Temperature change.
Applications and Experimental Methods
Electronic Component Testing: Reliability testing and product screening tests are conducted on electronic components to ensure their stable operation in complex temperature environments and to assess their safety and performance.
High Accelerated Limit Testing (HALT), High Accelerated Stress Screening (HASS), and High Accelerated Stress Inspection (HASA):
(1) High Accelerated Limit Testing (HALT): Used to quickly assess interconnect stress and mechanical stress. It is not suitable for life assessment and cannot calculate mean time between failures (MTBF). This test is conducted under stresses far exceeding the limits specified in the technical specifications, aiming to induce failures, transform potential defects into observable failures, reveal design weaknesses, and drive product optimization. Simultaneously, based on the limit conditions determined by HALT, a High Accelerated Stress Screening (HASS) scheme can be developed to eliminate defects in the manufacturing process, enabling products to quickly achieve high operational reliability.
(2) High Accelerated Stress Screening (HASS): Products are screened using stresses significantly higher than expected usage or transportation conditions, but the stress level is below the threshold that would significantly affect product life, and the combined stress does not exceed the product's operating limits. Its core objective is to induce and expose defects introduced during the manufacturing process.
(3) High Accelerated Stress Inspection (HASA): As a process monitoring method, samples are taken from the production batch and subjected to HASS stress in order to identify possible manufacturing defects.
Test Cycle Flow
1. Lower the air temperature inside the test chamber to the specified low temperature TA at a set rate;
2. After the temperature inside the chamber stabilizes, expose the test sample continuously at the low temperature TA for a specified time t1;
3. Raise the air temperature inside the test chamber to the specified high temperature TB at a set rate;
4. After the temperature inside the chamber stabilizes, expose the test sample continuously at the high temperature TB for a specified time t1;
5. Finally, lower the air temperature inside the test chamber to the laboratory ambient temperature of 25℃±5K at a set rate.