Environmental Testing Equipment That Must Be Used For High-quality Chips

With the continuous advancement of science and technology, semiconductor chips have become an indispensable part of modern society and are widely used in computers, communications, automobiles, aviation and other fields. At the same time, the development of semiconductor chips has also become an important symbol of the country's scientific and technological level, playing a vital role in the development of the national economy and the promotion of scientific and technological development.

In the research and development process of semiconductor chips, environmental testing equipment is an indispensable part. Environmental testing equipment can simulate various actual use environments and conduct various environmental tests on chips, such as high temperature, low temperature, humidity, corrosion resistance, vibration, impact, etc., to evaluate the quality, reliability and stability of the chip. Through the testing of environmental testing equipment, problems and defects in the design, manufacturing and use of chips can be effectively discovered, providing a basis for further optimization and improvement of chips. Environmental test chamber is a common environmental testing and testing equipment. It has the following characteristics and advantages:

Temperature control: The environmental test chamber can simulate various temperature environments, such as high temperature, low temperature, etc., to test the performance and stability of the chip at different temperatures.
Humidity control: The environmental test chamber can simulate various humidity environments, such as high humidity, low humidity, etc., to test the performance and stability of the chip under different humidity.
Atmosphere simulation: The environmental test chamber can simulate various atmosphere environments, such as oxygen deficiency, oxygen enrichment, etc., to test the performance and stability of the chip in different atmospheres.
Multi-environmental factor control: The environmental test chamber can simulate a variety of environmental factors, such as high temperature, low temperature, high humidity, low humidity, oxygen deficiency, oxygen enrichment, etc., to test the performance and stability of the chip in different environments.
Automated control: The environmental test chamber can adopt an automated control system, which can automatically control test temperature, humidity, atmosphere and other parameters to improve test efficiency and accuracy.
In the research and development process of semiconductor chips, the role of environmental test chambers is very important. Through testing in the environmental test chamber, the performance and stability problems of the chip in various environments can be discovered, providing a basis for further optimization and improvement of the chip. At the same time, the environmental test chamber can also evaluate the reliability and stability of the chip, providing guarantee for the quality control and productization of the chip. Among them, Shanghai Baiyi high temperature aging chamber, double 85 constant temperature and humidity test chamber, hot and cold shock test chamber, rapid temperature change test chamber, PCT test chamber and HAST test chamber are environmental test chamber suites favored by many chip R&D companies. They can simulate Different environmental conditions, detect the performance and failure of the chip in different environments.

The high-temperature aging chamber is a commonly used test equipment in the chip research and development process. It can simulate high-temperature environments and test the performance and stability of chips in high-temperature environments. Using a high-temperature aging chamber to conduct high-temperature aging tests on chips can reveal the following quality problems of the chips:
1. Performance changes during the aging process: In high temperature environments, the chip's logic circuits, memory, etc. may be damaged, causing the chip's performance to decline or become abnormal.
2. Failure mode: The high-temperature aging test can simulate the failure mode of the chip in a high-temperature environment, such as circuit locking, thermal fuse, gate circuit damage, etc., to further analyze the cause of chip failure.
3. Thermal stability: The high-temperature aging test can evaluate the thermal stability of the chip, that is, the stability and reliability of the chip in a high-temperature environment. If the performance of the chip decreases or becomes abnormal at high temperatures, it indicates that its thermal stability is poor.
4. Quality reliability: The high-temperature aging test can detect the quality reliability of the chip, that is, the life and reliability of the chip in a high-temperature environment. If the chip experiences early failure or abnormality at high temperatures, it indicates that its quality and reliability are poor.

The double 85 constant temperature and humidity test chamber is a special test chamber specially used to test the heat resistance, cold resistance, dryness resistance and humidity resistance of electronic components in various environments. It can test the temperature of 85℃ and the humidity of 85%. Aging tests are conducted on the test bodies to determine the reliability, lifespan and performance changes of the products in high temperature and high humidity environments. Chips are prone to circuit short circuit, oxidation and other failures under high temperature and high humidity, including circuit short circuit, open circuit, component burnout, etc. The Double 85 constant temperature and humidity test chamber can detect these failures and optimize the chip manufacturing and packaging process.

Chips are prone to thermal stress failure under sudden temperature changes. The thermal shock test chamber can simulate this sudden temperature change environment and test the performance and stability of the chip under sudden temperature changes. When testing the ability of other electronic components to withstand impact and high-temperature aging, a hot and cold shock test chamber is also a necessary option. Thermal shock test chamber can detect chip failure, including chip pad detachment, circuit breakage, etc. Using a thermal shock test chamber can detect the thermal stress failure of the chip, thereby helping chip design companies optimize the design and manufacturing process of the chip.

The rapid temperature change test chamber can simulate an environment with rapid temperature changes and test the performance and stability of chips under rapid temperature changes. Currently, most chips use a heating and cooling rate of 10°C and 15°C, and military-grade chips are required to be able to perform a heating and cooling rate of 20°C. Chips are prone to electromigration, leakage and other failures under rapid temperature changes. The rapid temperature change test chamber can conduct multiple temperature change tests on the chip in a short period of time to detect the thermal fatigue performance and thermal expansion coefficient of the chip, including the shedding of the chip pad. , line break. Rapid temperature change testing can help companies optimize the chip manufacturing and packaging process.

The PCT test chamber can simulate an environment of high humidity, high temperature, and high pressure, and test the performance and stability of the chip under conditions of high humidity, high temperature, and high pressure. The PCT test can help discover some problems that may occur when the chip is exposed to high temperature and high humidity environments, including but not limited to the following aspects:
1. Leakage and electrical failure: In high temperature and high humidity environments, leakage or electrical failure may occur in the conductive path of the chip. The PCT test can simulate this environment and detect possible problems with the chip by detecting current leakage and changes in electrical performance.
2. Corrosion and oxidation: In a high-humidity environment, the metal parts of the chip are susceptible to corrosion and oxidation. The PCT test can expose the chip to humidity conditions and observe whether there are signs of corrosion and oxidation on the metal surface to evaluate its corrosion resistance.
3. Packaging failure: The packaging material of the chip may deform, crack or fail in a high temperature and high humidity environment. The PCT test can evaluate the reliability of packaging materials under such conditions and identify possible packaging problems.
4. Interface contact problems: The contact interfaces such as chip connectors, solder joints, and pins may be affected by high temperature and high humidity environments, resulting in poor contact or disconnection. The PCT test can help discover problems such as leakage, electrical failure, corrosion and oxidation, packaging failure and interface contact that may occur in the chip in high temperature and high humidity environments. It can detect and solve these problems in advance and improve the reliability and stability of the chip.

High temperature aging chamber, double 85 constant temperature and humidity test chamber, hot and cold shock test chamber, rapid temperature change test chamber, PCT test chamber all play a very important role in the chip development process. They can simulate different environments. Conditions, detect chip failure, thereby providing important data support and reference for chip R&D and production, and providing a basis for further optimization and improvement of chips.

BOTO GROUP LTD. is dedicated to the research and development, manufacturing, sales, maintenance services, solutions and systems of reliability test technology and climate environment simulation equipment for electronic products, automobiles and their parts, aerospace products, chemical products and welding manufacturing products. Integrated manufacturers and service providers. The company is headquartered in Shanghai and its production bases are located in Hunan and Guangdong. It is a high-tech enterprise, a specialized and special new enterprise in Shanghai, and a specialized and special new enterprise in Hunan.

Our company main products include high and low temperature test chambers, constant temperature and humidity test chambers, hot and cold shock test chambers, rapid temperature change test chambers, high altitude and low pressure test chambers, temperature/humidity/vibration three comprehensive test chambers, salt spray test chambers and other environmental tests Equipment; PCT and other reliability testing equipment; walk-in and vehicle-in climate environment simulation and detection systems, multi-factor environment simulation systems, non-standard customized test systems and comprehensive reliability testing solutions. It has a number of patented technologies and has passed ISO9001 : 2015 quality management system certification, capable of producing environmental testing equipment that meets various international standards such as MIL, IEC, and DIN. Products are widely used in various laboratories and third-party testing institutions, involving many fields such as consumer electronics, automotive industry, aerospace, intelligent manufacturing, energy storage batteries, 5G communications, metrology, railways, electric power, medical and scientific research institutions.

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